2026-08-12
Why does the semiconductor need thin films?
A single chip is, in essence, a three-dimensional structure formed by the precise stacking of hundreds of thin-film layers.
Each layer serves a specific function:
| Thin Film Type |
Function |
Typical Materials |
| Conductive Layer | Conduct electric current and connect devices | Al, Cu, W, TiN |
| Insulation Layer | Isolate circuits and prevent electric leakage | SiO₂, SiN, Low-k |
| Barrier Layer | Prevent diffusion and improve reliability | TaN, TiN, W |
| Gate Material | Control device switching | Poly-Si, Metal Gate |
| Passivation Layer | Protect surface and enhance stability | SiN, SiON |
| Dielectric Layer | Store electric charge to realize functions |
|
Semiconductor thin film technology
How is the film formed?
1. Material Source: Solid target, gaseous reactant or chemical precursor;
2. Transport: Via plasma, vacuum, carrier gas or diffusion;
3. Surface Reaction: Physical adsorption or chemical reaction occurs on the wafer surface;
4. Nucleation & Growth: Atomic aggregation for nucleation, island growth, continuous film formation and densification;
5. Film Formation: Form a thin film with increasing thickness, dense structure and stable microstructure.
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